Good Adhesive, Bad Bond: David Dworak on the Hidden Causes of Adhesion Failure - Episode 199

Adhesive failures can be frustrating because the problem isn’t always obvious. The adhesive may have been properly selected, the part may look clean, and the process may seem under control. But weeks or months later, a coating lifts, an encapsulant separates, or a bond fails in the field. So what went wrong?

In this episode of Reliability Matters I’m joined by David Dworak, Material Scientist at Dymax, to discuss the science behind reliable adhesion in electronics manufacturing.

We’ll talk about why adhesive bonding is about much more than choosing the right material. David explains the role of adhesive chemistry, surface energy, wetting, contact angle measurement, surface preparation, plasma treatment, and why even a visually clean surface may not be ready for bonding.

We’ll also explore how manufacturers can troubleshoot adhesion failures, control their bonding process, and gather objective evidence that a surface is truly ready for adhesive application.

If your process involves conformal coatings, encapsulants, underfills, component bonding, or any adhesive used in electronics assembly, this conversation will help you better understand what really makes a bond reliable.

Dymax https://dymax.com

“The Principals of Adhesion: Understanding Adhesive Chemistry, Application and Surface Science for Optimal Bonding Performance.” https://circuitsassembly.com/ca/editorial/menu-features/43078-the-principals-of-adhesion-understanding-adhesive-chemistry-application-and-surface-science-for-optimal-bonding-performance.html