
Show Notes
On today’s episode, we’re turning our focus to a pivotal innovation that has transformed design and manufacturing processes: flexible circuits.
Flexible circuits have emerged as a game-changer in the manufacturing and design of electronic assemblies. With their unique ability to bend, twist, and conform to complex shapes, they offer unparalleled advantages in applications where space is at a premium and reliability is paramount. From wearable technology and medical devices to aerospace systems and consumer electronics, the use of flexible circuits has expanded rapidly, bringing with it both opportunities and challenges. In this episode, we’ll explore the evolution of flexible circuit technology, discussing its key benefits, such as lightweight construction, enhanced durability, and improved design freedom.
We’ll also touch on the manufacturing complexities, material considerations, and the critical role that process control plays in ensuring reliability and performance.
My guest today is Joseph Fjelstad. Joe is the founder of Verdant Electronics. Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including as a chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones. He is an internationally recognized expert, inventor and lecturer in the field of electronics interconnection technology and a veteran of several startup companies, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now the public company, Xperi).
Some of Joe’s innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today.
He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics — The SAFE Approach.
In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades. And today, he’s the guest on my show.
Here is a list of Joe's books: Flexible Circuit Technology 4th Edition https://iconnect007.com/my-i-connect007/books/flex-circuit-technology
Chip Scale Packaging for Modern Electronics https://www.emerald.com/insight/content/doi/10.1108/cw.2004.21730bae.001/full/html
Solderless Assembly for Electronics: The SAFE Approach https://iconnect007.com/my-i-connect007/books/solderless-assembly-electronics-safe-approach#:~:text=SAFE%20technology%20(Solderless%20Assembly%20For,design%20efficacy%2C%20reliability%20and%20security.
Joe's Company: Verdant Electronics https://verdantelectronics.net
Chapters: 00:00:00 Importance of Flexible Circuits in Modern Electronics 00:02:42 Exploring the World of Flexible Circuits 00:05:30 Introduction to Flexible Circuits: A Historical Perspective 00:08:43 Entrepreneurship Mindset: Naivety and Innovation 00:11:08 The Value of Naivety in Engineering 00:13:43 Innovations in Bubble Printing Technology 00:16:47 Understanding Flex Circuits: Applications and Challenges 00:19:58 The Lifespan and Failure of Torsion Bars 00:22:21 Evolution of Soldier Technology: From Heads-Up Displays to Wearables 00:25:24 The Origins of the Integrated Circuit 00:28:13 Advances in Microelectronics: From Printed Transistors to Modern Tech 00:31:28 Challenges and Solutions in Flexible Circuit Design 00:34:00 Collaborative Design for Efficient Manufacturing 00:36:49 Advances in Flexible HDI and the Upcoming Ultra HDI Conference 00:39:46 Evolution of Flexible Circuits: From 1903 to Present 00:42:40 Innovating Flexible Circuits 00:45:13 Evolution of Toll Road Technology 00:48:08 The Future of Flexible and Stretchable Circuits 00:51:53 Introduction to Verdant Electronics 00:54:46 The Military's Stance on Lead-Free Technology 00:56:27 Innovating Solderles
More from Reliability Matters
Reliability Matters at 200: The Conversations, Lessons, and People Behind the Podcast
Adhesive failures can be frustrating because the problem isn’t always obvious. The adhesive may have been properly selected, the part may look clean, and the process may seem under control. But weeks or months later, a coating lifts, an encapsulant separates, or a bond fails in the field. So what went wrong?
Artificial intelligence is everywhere right now. It’s in the headlines, it’s being built into software tools, and it’s showing up in more and more conversations about engineering, manufacturing, quality, and process improvement.
What if passing the test is not enough?
Today, we’re going to explore a topic that seems to be touching nearly every industry, every workplace, and increasingly every part of our daily lives: artificial intelligence.